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Let's talk about thermal integrity for electronics systems. Ansys Icepak is a specialized software that predicts thermal field and cooling solutions for IC packages, printed circuit boards and complete electronics systems. Icepak also contains readily available macros to ease meshing, post-processing and even creating test beds.

In this blog, I would like demonstrate a macro named "Extract JB and JC" that automatically builds and executes the JEDEC test environment to calculate IC package thermal resistances to case (Theta_JC) and board (Theta_JB). The following 8-minute video shows the full workflow to achieve this.


Mert Berkman
Post by Mert Berkman
April 12, 2024