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Discover how Ansys simulations can be used to evaluate PCBA reliability in the face of shock and vibrations.

The Role of Shock and Vibrations in PCBA Failure

PCBA reliability testing is crucial in ensuring the performance and durability of printed circuit board assemblies (PCBAs). One of the main factors that can lead to PCBA failure is the presence of shock and vibrations. When a PCBA is subjected to external forces, such as drops, impacts, or vibrations, it can result in various issues like component damage, solder joint failures, or electrical connectivity problems.

Shock and vibrations can cause mechanical stress on the components and solder joints, leading to fatigue and eventual failure. The repeated stress cycles can weaken the materials and compromise their structural integrity over time. Moreover, the vibrations can also induce micro-fractures in the solder joints, which can affect the electrical performance and reliability of the PCBA.

Therefore, understanding the role of shock and vibrations in PCBA failure is essential for designing robust and reliable PCBAs. By evaluating the effects of shock and vibrations through simulations, engineers can identify potential weaknesses and make design improvements to enhance the reliability and durability of the PCBA.

Ansys Simulations for PCBA Reliability

Ansys simulations provide a powerful tool for evaluating PCBA reliability in the face of shock and vibrations. Ansys software enables engineers to simulate real-world conditions and analyze the behavior of the PCBA under different stress scenarios.

Using finite element analysis (FEA) techniques, Ansys simulations can accurately predict the structural response of the PCBA to shock and vibrations. By modeling the PCBA's geometry, material properties, and boundary conditions, engineers can simulate the dynamic behavior and evaluate the stresses, strains, and displacements experienced by the components and solder joints.

Key capabilities

  • Full detailed PCBA shock and vib reliability analysis
  • Time to failure prediction for every component on PCBA
  • PCB trace distribution included in analysis
  • Large library of laminates and solders for reliability comparisons

PCBA shock deformation

PCBA max deformation due to shock

Overall, Ansys simulations provide a cost-effective and efficient approach to evaluating PCBA reliability, enabling engineers to identify and address potential issues before the physical prototyping and testing stages.

Ozen Engineering Expertise in PCBA Shock and Vibration Analysis

Ozen Engineering specializes in PCBA shock and vibration analysis using Ansys simulations. With decades of experience and expertise in the field, Ozen Engineering offers comprehensive solutions to evaluate and improve the reliability of PCBAs in the face of shock and vibrations.

Ozen Engineering's team of skilled engineers can assist in conducting Ansys simulations tailored to JEDEC and other PCBA requirements. They can accurately model the PCBA geometry, material properties, and environmental conditions to simulate realistic shock and vibration scenarios.

By leveraging the advanced Ansys Sherlock and Ansys Mechanical, Ozen Engineering can analyze the simulation results to identify potential failure modes, optimize the design, and recommend appropriate mitigation strategies. Their expertise in PCBA shock and vibration analysis ensures that the PCBAs are robust, reliable, and capable of withstanding harsh operating conditions.

PCBA shock profile

Typical JEDEC half-sine shock profile

PCBA life curve

PCBA time to failure table

In addition to simulation software solutions, Ozen Engineering also provides consulting and training to help engineers develop their skills in PCBA reliability testing and analysis. They offer valuable insights and guidance to enhance the overall reliability and performance of PCBAs.

With Ozen Engineering's expertise in PCBA shock and vibration analysis, engineers can confidently evaluate and improve the reliability of their PCBAs, ensuring their performance and longevity in demanding applications.

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Post by MingYao Ding
November 22, 2023