Ansys Electronics Desktop (AEDT) is a unified platform for electromagnetic, thermal, circuit and system simulation. AEDT Icepak is a CFD solver for electronics thermal management that is built natively in the AEDT environment and tightly integrated. Please note that while similar in many ways, AEDT Icepak has a different user interface than Classic Icepak that is a stand-alone tool.
Fig. 1 AEDT Icepak capabilities
Almost all failure mechanisms in electronics are enhanced at higher temperatures. Therefore, accurate thermal modeling of electronics components are critical to the design process. AEDT Icepak also enables easy two-way coupling with EM tools (HFSS, HFSS3D Layout, Maxwell, Q3D and SI Wave) within the same GUI.
Fig.2 Thermal analysis coupled with EM
Demonstration of AEDT Icepak with Electronics Cooling
First a STEP file will be imported for the model, and the heatsink, fans and thermal networks will be added. The model is shown below:
Fig. 3 Model schematics
The video below may be used as a tutorial to learn the graphical user interface of AEDT Icepak and generate geometries. We will also set up thermal and flow boundary conditions as well as complete the problem setup.
Once the geometry is ready, in the next video, we will generate a conformal mesh and set it up for calculation. Finally, we will solve the fluid flow and heat transfer problem and post-process the results.
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Suggested blogs
- Ozen Engineering Inc. Blog: Ansys Icepak and electronic cooling analysis
- Ozen Engineering Inc. Blog: Cold Plate Modeling with Ansys AEDT Icepak
- Ansys Webinar: Dynamic Thermal Management using Ansys Icepak in AEDT
