Electronic components generate heat when in operation. These components are traditionally cooled using air (Natural or forced convection) or heat pipe assemblies. Immersing electronic components in liquid allows for a larger cooling capacity when compared to traditional systems.
In this video, we demonstrate how to set up an immersion cooling simulation in Ansys Fluent. We start with a PCB geometry and generate a flow domain around it using the Ansys SpaceClaim 3D modeling software. The geometry is then transferred to Fluent meshing, where we use the parallel meshing capability to generate a high-quality poly hex-core volume mesh. The program is switched to the solver mode and set up for calculation.
The first solution is a single-phase problem where water flows over the electronic component. The maximum temperature of different PCB components is computed. Next, the multiphase model is enabled, and a mass transfer model is set up to activate phase change. The addition of mass transfer allows for the utilization of latent heat (evaporative heat transfer) for cooling on top of sensible heat. As the solution computes, it showcases that including evaporative heat transfer reduces the maximum temperature of the electronic components significantly.
From cooling electronics to managing thermal loads in data centers, immersion cooling is a powerful tool that can help solve heat-related challenges in various industries. Whether you are a student, researcher, or engineer, this video will provide valuable insights into Ansys Fluent's immersion cooling capabilities.
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Somenath Chatterjee, Ph.D.
Senior Application Engineer
Ozen Engineering, Inc. - Ansys Elite Channel Partner
America’s Channel Partner of the Year: 2015, 2018, 2021
Phone: 408-416-3240 Email: somenath.chatterjee@ozeninc.com
1210 E Arques Ave., #207, Sunnyvale, CA 94085
April 27, 2023