Almost all failure mechanisms in electronics are enhanced at higher temperatures. Therefore, accurate thermal modeling of electronics components are critical to the design process. Ansys Icepak (Classic Icepak) is an integrated electronics cooling solution for IC packages, printed circuit boards and complete electronic
systems.
Fig. 1 Ansys Icepak capabilities
Demonstration of Icepak for RF Amplifier Cooling
First we will create the geometry of our model using primitive Icepak objects without any CAD data. The parts will include fan, heatsink, heat sources, enclosure, walls and openings. The following video demonstrates the process step-by-step and in detail.
The second part of our video includes meshing, set up thermal and flow model, execution and post-processing. Many features of Icepak are touched upon.
Ozen Engineering Expertise
Ozen leverages its extensive consulting expertise in CFD, FEA, optics, photonics, and electromagnetic simulations to achieve exceptional results across various engineering projects, addressing complex challenges like multiphase flows, erosion modeling, and channel flows using Ansys software.
We offer support, mentoring, and consulting services to enhance the performance and reliability of your hydraulic systems. Trust our proven track record to accelerate projects, optimize performance, and deliver high-quality, cost-effective results for both new and existing water control systems. For more information, please visit https://ozeninc.com.
Suggested blogs
- Ozen Engineering Inc. Blog: Ansys Icepak and electronic cooling analysis
- Ozen Engineering Inc. Blog: Cold Plate Modeling with Ansys AEDT Icepak
- Ansys Webinar: Dynamic Thermal Management using Ansys Icepak in AEDT
