SUMMARY
As electronic systems become more compact and complex, engineers face increasing challenges when simulating printed circuit boards (PCBs) and other layered electronic assemblies. Accurately capturing thin stacked geometries while keeping computational costs manageable is no easy task. That’s where the Stacker Mesh Workflow in Ansys Mechanical comes into play — offering a smarter, faster, and more efficient meshing strategy built specifically for multilayer electronic components.
What Are Mesh Workflows?
The Mesh Workflow framework in Ansys introduces a step-by-step, customizable approach to mesh generation. Instead of relying on traditional, monolithic meshing processes, a workflow is composed of sequential Steps, each representing a specific meshing operation. These are connected through Controls (which define inputs and algorithm parameters) and Outcomes (which capture the results and feed data into subsequent steps).
This modular structure makes the entire meshing process more transparent, flexible, and reusable, while also allowing engineers to parameterize and automate even complex meshing procedures.
The PrimeMesh Model — A Smarter Geometry Engine
Under the hood, Mesh Workflows operate using the PrimeMesh model, a lightweight and flexible computational domain. Unlike traditional CAD-based systems, PrimeMesh:
- Works independently of CAD constraints, reducing failures caused by Boolean operations or inconsistent geometry.
- Allows modifications and defeaturing directly on the mesh domain.
This means engineers can clean up and mesh even the most intricate PCB geometries quickly and reliably, without getting stuck in the geometry-preparation phase.
What Makes the Stacker Workflow Special
The Stacker Mesh Workflow was designed to simplify the meshing of layered structures — like PCBs, IC packages, and other electronics that include multiple thin bodies stacked in regular patterns.
The workflow works by mapping a 3D model to a 2D plane, generating a high-quality 2D surface mesh, and then stacking it along a defined direction to reconstruct the 3D volume. This approach offers significant advantages:
- Reduced mesh count and computation time while maintaining geometric fidelity.
- Simplified meshing of thin layers without the need for extreme aspect ratios.
- Automation of repetitive meshing tasks across similar PCB components.
- Robustness for detecting stackable and non-stackable bodies automatically.
Main Characteristics of the Stacker Workflow
Below are some of the key configurable settings and operations that make the Stacker workflow so flexible and powerful:
1. Origin and Direction Control
You can define the Origin (X, Y, Z) and Direction (X, Y, Z) for the stacking operation, specifying exactly where and how the 3D structure is projected. These parameters are fully parametrizable, enabling design studies or optimization loops.
2. Defeaturing Controls
The workflow includes Lateral Defeature Size and Stacking Defeature Size settings that automatically clean up small edges or gaps both laterally and along the stacking direction — a crucial feature when dealing with fine PCB traces or thin dielectric layers.
3. Non-Stackable Body Handling
Not all geometry in a model fits the stacking logic. The Non-Stackable Body Mesh Size control ensures these parts are meshed appropriately using standard 3D meshing methods, keeping the process consistent.
4. Sequential Workflow Steps
Each Stacker Workflow executes through a predefined but customizable sequence:
- Merge Parts – Combines all scoped parts.
- Detect Stackable Bodies – Identifies which components can be flattened and stacked.
- MultiZone Volume Meshing – Generates mesh for non-stackable components.
- Diagnostics – Reports the smallest edges and bounding dimensions.
- Flatten Volume – Projects the geometry onto a base plane.
- Mesh Surface – Generates the 2D mesh.
- Mesh Volume – Reconstructs 3D mesh by stacking the 2D layers.
- Delete Base Face – Cleans up temporary surfaces used for meshing.
Why It Matters for PCB and Electronics Applications
For PCB and electronics engineers, the Stacker Mesh Workflow dramatically simplifies what used to be a tedious and error-prone process. Its ability to automatically detect, flatten, and rebuild layered geometry is a game-changer for:
- Multi-layer PCB boards with vias and embedded components.
- Electronic packaging with stacked dies or insulation layers.
- Thermal and structural analyses requiring accurate layer representation.
By reducing preprocessing time and improving mesh consistency, Stacker lets engineers focus on design performance rather than mesh troubleshooting.
Conclusion
The Stacker Mesh Workflow in Ansys represents a major step forward for electronics simulation. By combining automation, robustness, and flexibility, it empowers engineers to handle complex layered models with confidence. Whether you’re modeling multi-layer PCBs, semiconductor stacks, or thin-film assemblies, Stacker provides the efficiency and control you need to keep your analyses both accurate and fast.
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Ozen Engineering Expertise
Ozen Engineering Inc. leverages it's extensive consulting expertise in CFD, FEA, thermal, optics, photonics, and electromagnetic simulations to achieve exceptional results across various engineering projects, addressing complex challenges like multiphase flows, erosion modeling, and channel flows using Ansys software.
We provide expert consulting, mentoring, and training to optimize hydraulic and water control systems. Our team leverages advanced simulation tools like Ansys Fluent to deliver precise, reliable solutions for piezoelectric actuator design and analysis. For details, visit https://ozeninc.com.