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All articles from Luis Maldonado
Electronics Reliability
•
Aug 12, 2025 12:41:33 PM
Flip-Chip Package Theta-JA Thermal Resistance Characterization Using Ansys Fluent
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Electronics Reliability
•
Jul 28, 2025 10:37:51 AM
Flip-Chip Package Theta-JB and Theta-JC Thermal Resistance Characterization using Ansys Fluent
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Luis Maldonado
Topics
Electronics Reliability
heat transfer
ANSYS fluent
Flip-chip
theta-JA
theta-JB
theta-JC