This blog details the step-by-step process required to set up a coupled thermal analysis by importing the heat transfer coefficient (HTC) from your AEDT Icepak simulation directly into Ansys Mechanical. The procedure shown here can also be used to export other thermal and flow variables, including temperature and pressure.
Multiphysics simulation is essential for modern electronics cooling because thermal performance is intrinsically linked to other physical domains. The primary challenge lies in accurately coupling these phenomena, most notably the Electro-Thermal (Joule heating from current flow) and Thermo-Mechanical (stress and warpage from thermal expansion) effects. Furthermore, models are complicated by multiscale issues, where phenomena must be resolved simultaneously from the small scale of an IC die (microns) up to the system level (meters), all while managing the simplification of complex CAD geometry and ensuring numerical accuracy and stability when coupling the physics. In this blog, we will address how to face these challenges by using AEDT Icepak for electronics cooling and Ansys Mechanical for thermal analysis. We will describe how to use the results from AEDT Icepak as a starting point for the thermal analysis in Ansys Mechanical.
For this demo, we will use a simple cold plate geometry with three heat sources. The case will be solved in a vacuum environment, so the only fluid present is the fluid flowing through the cold plate. More detailed information is shown in the figure below.
This blog is focused on the steps to export the heat transfer coefficient from your AEDT Icepak simulation. You can check the video and the files attached to this blog to learn more about the simulation setup.
In order to export the HTC values, we need to use the Field Calculator tool in Icepak. We will assume that you already have the Icepak simulation finished and ready for postprocessing.
The first step is to access the field calculator by clicking on Icepak in the toolbar, then Fields, and finally Calculator.Having the Fields Calculator tool open, follow the next step in order:
For this section, we will assume you already have your Thermal Mechanical project with the geometry, the mesh, and the boundary conditions ready.
After the heat transfer coefficient is imported, we can run the Ansys Mechanical analysis.
The comparative analysis between temperature distribution results from the AEDT Icepak (CFD) and Ansys Mechanical (FEA) solutions yielded highly consistent results, providing strong confidence in the predicted thermal performance for this demo design.
The maximum temperature calculated was similar in both simulations, 56.47 °C in Icepak vs 56.82 °C in Ansys Mechanical, validating the thermal results for our problem. Beyond the peak value, the overall thermal gradient and temperature distribution patterns showed a strong correlation, as shown in the thermal contour comparison below.
Minor solution variations are expected when comparing results across different types of solvers. Differences arise due to the difference in mesh strategies, with Icepak employing a volume-based mesh, while Ansys Mechanical employs a node-based element mesh, leading to distinct ways of modeling and treating the geometry boundaries. In addition, the underlying mathematical discretization techniques used by the respective solvers will always introduce minor, localized variations in the final calculated values.
The procedure shown here shows how to export the heat transfer coefficient from AEDT Icepak to Ansys Mechanical. However, this procedure can also be used to export other thermal and flow variables, including temperature and pressure. These fields can be used as boundary conditions to do thermal, static, or coupled analysis in Ansys Mechanical
You can download the Icepak case files here and the Mechanical case files here.
Ansys provides powerful thermal simulation capabilities for semiconductor design, enabling engineers to analyze geometry configurations, material distributions, interconnect types, underfill properties, and substrate thickness—all without building physical prototypes. Ansys has specialized tools like Icepak for electronics cooling, SiWave for signal and power integrity, Maxwell and HFSS for electromagnetic analysis, Mechanical for structural and thermal simulations, Ansys Fluent for thermal and fluid simulations, and DesignXplorer and OptiSLang for design optimization and parametric evaluation, making it a comprehensive suite for multi-physics modeling and performance refinement.
Ozen Engineering Inc. leverages its extensive consulting expertise in CFD, FEA, thermal, optics, photonics, and electromagnetic simulations to achieve exceptional results across various engineering projects, addressing complex challenges like multiphase flows, erosion modeling, and channel flows using Ansys software.
We offer support, mentoring, and consulting services to enhance the performance and reliability of your hydraulic systems. Trust our proven track record to accelerate projects, optimize performance, and deliver high-quality, cost-effective results for both new and existing water control systems. For more information, please visit https://ozeninc.com.
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